The autumn edition of Automotive World 2026 will take place at Makuhari Messe in the greater Tokyo area from September 9 to 11, and TIER IV will be there showcasing initiatives, including an open AI-native computing platform for software-defined vehicles (SDVs) developed in collaboration with an industry partner. We will also introduce SDV solutions that harness our Co-MLOps platform, integrating AI, data and compute.
Event details
- Dates: September 9-11 10:00 a.m.-5:00 p.m.
- Venue: Makuhari Messe (Halls 1-3)
- Booth number: COVESA Special Exhibition Area A3-52
- Official website: https://www.automotiveworld.jp/autumn/en-gb.html
Booth highlights
1. E2E AI-based Level 2 ADAS Vision Pilot running on Renesas’ R-Car X5H
Learn about the integration of Vision Pilot – open-source software developed by the Autoware Foundation for advanced driver assistance systems (ADAS) leveraging end-to-end (E2E) AI – with Renesas’ R-Car X5H automotive system-on-chip.
For more information, see details: TIER IV collaborates with Renesas to build an open AI-native computing platform for SDVs: Integrating R-Car Gen 5 automotive SoCs with Autoware and reference AI models
2. Reference E2E AI model
Explore an AI-driven development approach using TIER IV’s Co-MLOps platform. The demonstration focuses on key capabilities such as data search, autolabeling and data generation, including a complete end-to-end development workflow. Our reference E2E AI model was autonomously created through agentic AI development using automatically labeled and generated driving data. Running on NVIDIA Jetson Orin, the model performs everything from bird’s-eye-view perception of the surrounding environment to trajectory generation using only cameras.
For more information, see details: TIER IV to showcase integrated AI, data, and computing solution for SDVs at Automotive World 2026
3. TIER IV prototype chip for autonomous driving
See a prototype chip designed to improve the power efficiency of LiDAR point cloud data processing, supporting the advanced AI processing required for autonomous driving more efficiently and safely. The chip was developed as part of a project supported by the New Energy and Industrial Technology Development Organization (NEDO).
TIER IV is developing computing platforms to support automakers and suppliers in the mass production of autonomous driving systems for passenger vehicles, while also building solutions for SDVs, with the goal of accelerating the broader deployment of autonomous driving technology.
If you are attending Automotive World 2026, be sure to stop by the TIER IV booth. We look forward to sharing our latest progress with you at the show.
Media Contact
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